Intel Ohio

Why I believe this site is the key for American chip sovereignty & the heart of the new defense hub focused around Wright-Patterson Air Force Base

The Future of American Semiconductors

Control Thesis - Why This is the Biggest Top Watch Looking Towards 2028

Intel Ohio is not a simple semiconductor project.. its the United States rebuilding control over time in modern conflict

In advanced warfare, power no longer comes from who fabricates the most wafers but from who controls iteration under stress: design acceptance, packaging security, validation authority, and continuity when logistics, insurance, and capital fail

Ohio was selected because it is the first place where all five collapse inward

The Genesis Mission and American Silicon Power in Ohio

The United States is executing a real, active national mission to rebuild sovereign, survivable, inland semiconductor capability after decades of offshore dependence

Everything below explains why this outcome is no longer optional

By March 24 we will hopefully know whether or not an Ohio anchor customer has formally stepped forward with the likely customers being DoD or Amazon AWS

Why Genesis Mission Exists?

The Old Semiconductor Order Is Fragile

For more than thirty years, U.S. semiconductor strategy optimized for:

• lowest marginal cost

• offshore concentration

• maritime logistics

• just-in-time efficiency

That model worked in peace but fails under confrontation

Modern power is no longer determined by who fabricates the most wafers.... its determined by who controls:

• design acceptance

• packaging security

• certification timelines

• iteration speed under disruption

• continuity under escalation

None of those controls can remain offshore

The global semiconductor system was built for efficiency not survivability & under stress it fragments:

• maritime insurance withdraws

• ports stall

• packaging queues freeze

• certification timelines stretch

• capital hesitates

What the Genesis Mission Actually Is?

Genesis is the national mission to reconstitute sovereign U.S. silicon as a closed, survivable system

Genesis is not about first fabs... its about the first irreversible system

Genesis means:

• Ending reliance on foreign packaging and substrates for advanced systems

• Collapsing build → validate → deploy loops inside U.S. borders

• Ensuring continuity of advanced compute under wartime conditions

• Creating inland industrial systems that survive logistics collapse, insurance withdrawal, and capital stress

You see this doctrine embedded in:

• Site selection

• Civil geometry

• Power topology

• Packaging priority

• Secure enclave scale

• Upstream design enablement

Intel Ohio is the first place where all Genesis conditions converge simultaneously

Sovereignty Is a Closed Loop Property

Sovereignty is not achieved by domestic fabrication alone

It exists only when every dependency inside the loop is survivable under stress

A system is sovereign only if:

• Design assumptions are domestic

• Fabrication is domestic

• Packaging is domestic

• Validation is domestic

• Deployment authority is domestic

• Continuity is preserved under escalation

If any link remains offshore, sovereignty collapses at that link..

Genesis exists because the United States previously controlled pieces of the loop but not the loop itself... and Ohio is where the loop closes

Secure Enclaves - The Sovereignty Gate

"A secure enclave is a physically and digitally isolated semiconductor manufacturing environment designed to support classified, export controlled, and sovereign silicon workflows"

It is not a software feature its an architectural condition of the fab itself

A secure enclave typically enforces:

• U.S.-only cleared personnel access

• Network isolation between classified and commercial flows

• Physical segregation of tool bays, utilities, and subfabs

• Auditable chain of custody from tape-out to packaged die

• Compliance by construction with ITAR, EAR, and DoD requirements

Within a secure enclave:

• Sensitive mask data remains under U.S. jurisdiction

• Classified wafers follow controlled operator and tool-access rules

• Packaging, test, and validation remain auditable and domestic

This is the minimum viable condition for modern defense silicon

Why Secure Enclaves Are Becoming Structurally Required

Historically U.S. defense programs tolerated:

• Offshore wafer fabrication

• Asian-dominated advanced packaging

• Maritime logistics dependencies

• Multi-year iteration cycles

That tolerance is shrinking rapidly

Modern defense and autonomy systems increasingly require:

• Custom ASICs with short refresh cycles

• Advanced 2.5D / 3D packaging

• Classified or export-controlled tape-outs

• Radiation-tolerant, autonomy-grade compute

Programs such as RAMP-C reflect this shift by pushing primes toward:

• Domestic wafer access at advanced nodes

• Auditable U.S.-controlled packaging paths

• Segmented manufacturing environments suitable for classified workflows

Secure enclaves are no longer optional they are the price of participation for advanced node, iteration sensitive, or classified systems

Why Intel Ohio Can Host Secure Enclaves at Scale

Secure enclaves can exist at multiple U.S. sites
What differentiates Ohio is scale, segmentation efficiency, and survivability under stress

• Many fabs face friction when implementing enclaves because they:

  • Share utilities and subfabs across production lines

  • Require retrofitted physical segmentation

  • Depend on globally mobile tool-service workflows

  • Sit inside logistics corridors exposed to escalation risk

Intel Ohio was designed with segmentation optionality from inception

Ohio’s advantages include:

• Compartmentalized subfab geometry enabling physical separation without redesign

• Utility architectures that can be segmented without disrupting adjacent lines

• Proximity to domestic packaging, substrate, and validation assets

• Access to cleared workforce pipelines and defense validation infrastructure within the same inland corridor

Why This Binds Success to Intel

Ohio does not succeed despite Intel’s execution risk - - it succeeds because Intel is the only company with:

• leading-edge U.S. process ownership

• domestic advanced packaging (EMIB / Foveros)

• secure enclave manufacturing capability

• defense-grade design enablement relationships

• the balance sheet to overbuild infrastructure before demand arrives

There is no second U.S. operator that can step into Ohio’s role if Intel were removed

Policy Now Reinforces the Loop

Federal policy has quietly shifted from incentives to enforcement

This is no longer about subsidies its about alignment

Key forces now point in the same direction:

• RAMP-C mandates domestic tape-out for advanced defense silicon

• Export-control bifurcation enables inland fabs to convert to defense-only operation

• Tariff regimes structurally reward domestic wafers over offshore supply

• Defense procurement now requires auditable, fully traceable supply chains

Upstream Materials Are Part of the Sovereignty Loop

Sovereignty often fails upstream in materials

One of the least discussed but most critical is electronic-grade glass cloth, the dielectric backbone of advanced substrates

• Nittobo controls the global performance frontier

• Owens Corning / AGY controls the American permission slip

Performance can be subsidized or forced but permissionless continuity cannot be imported

Why Ohio?

Ohio was selected because it offers the lowest friction convergence of survivability, power, validation, and scale

Intel is constructing what will become its most strategically important manufacturing node in the United States

Intel Ohio One sits in Licking County Ohio at the center of the inland industrial and defense spine
It is not a standalone fab & its the anchor of a multi decade national manufacturing system

Not because it is the newest and not because it is the largest

But because it was designed from inception to:

• Survive conflict

• Scale under pressure

• Absorb demand shocks without redesign

Inland Survivability

Inland geography removes entire adversary toolkits:

• No maritime dependency

• No port insurance exposure

• No naval chokepoints

• No evacuation-driven workforce collapse

This elevates Ohio from geography to command layer & it reframes everything downstream

In conflict geography becomes defense

Ohio is the first inland site capable of hosting conflict survivable leading edge logic at scale

Arizona is technically inland as well BUT the difference is they depend heavily on long-haul logistics corridors tied back to coastal ports

Power Sovereignty = Chip Sovereignty

Advanced fabs fail on power before they fail on yield... At advanced nodes power quality determines yield

Ohio sits at the intersection of two continental grids:

• PJM Interconnection

• MISO

• 

This dual grid positioning enables:

• Redundant baseload supply

• Surge load balancing

• Defense-priority allocation

• Insulation from single grid collapse

• 

Power Sovereignty = Chip Sovereignty

Ohio One exists because the electrical grid was engineered to sustain it under stress

Leading edge fabs fail because power becomes unstable before yield does

Ohio One sits at the center of a custom engineered energy system with massive power infrastructure built specifically for Intel

• New 500kV transmission corridors

• Major PJM grid upgrades

• Large scale AEP and Duke Energy substation expansion

• A de facto priority industrial load zone surrounding the campus

• Dual grid intersection: PJM + MISO - - one of the most resilient grid positions in North America

Why Ohio is Split

While most states fall under a single grid operator, Ohio’s utility companies joined different organizations based on their historical connections and geographical service areas

• PJM Interconnection: Covers most of Central, Northern, and Eastern Ohio

  • This includes major utilities like American Electric Power (AEP), FirstEnergy, and Dayton Power & Light

    • PJM is one of the largest competitive wholesale electricity markets in the world

• MISO (Midcontinent Independent System Operator): Primarily serves portions of Western and Northwestern Ohio

  • Utilities like Duke Energy Ohio are part of MISO, which stretches from the Gulf of Mexico up through the Midwest and into Canada

Key Implications of this Split

Market Dynamics: Ohio’s energy prices and grid reliability are influenced by two different market structures and sets of federal regulations

Infrastructure Challenges: Building new transmission lines across the state often requires coordination between both PJM and MISO, which can make large-scale renewable energy projects more complex to integrate

Cross-Border Flow: Because Ohio sits at this "intersection," it serves as a critical bridge for moving power between the East Coast (PJM) and the Midwest (MISO)

Yield Is Infrastructure

At advanced nodes yield is an infrastructure outcome

Below leading edge thresholds yield is governed less by recipes and more by whether the physical system can remain stable over time:

• Power is ultra-stable

• Thermal equilibrium is continuous

• Vibration is suppressed

• Metrology integrity is preserved

A perfect process running on unstable infrastructure will fail while an imperfect process running on hardened infrastructure will survive

That inversion is what the old semiconductor model never adapted to

At 14A and below failure does not announce itself.. Milliseconds of voltage instability invalidate EUV and High-NA metrology defect detection lags by hours or days and yield collapses before defects are visible

Advanced fabs fail silently through degraded statistical confidence
Once metrology integrity is lost recovery is measured in months not days

14A → 10A: RibbonFET and Backside Power - The Physics Gate

Intel’s 14A → 10A-class roadmap (~1.0–1.4nm effective) is engineered for survivability under sustained stress

14A will begin in Arizona & Oregon but end game is for Ohio to take lead with 14A come 2030

Ohio was designed around three non negotiable architectural shifts:

• RibbonFET (Gate-All-Around)

• PowerVia (Backside Power Delivery)

• High-NA EUV compatibility

RibbonFET replaces shrink with control
Full gate all around geometry improves electrostatic stability and reduces leakage - - favoring predictable behavior over burst frequency

• Exactly what defense, autonomy, and ISR silicon require under continuous duty cycles

  • Ohio’s civil geometry assumes GAA from inception

  • No FinFET legacy constraints

  • No redesign cliff at 14A and below

PowerVia makes infrastructure decisive
By moving power delivery to the wafer backside PowerVia reduces IR drop and routing congestion

• Also converts electrical instability into catastrophic yield loss

  • Milliseconds of voltage disturbance at 14A and below invalidate EUV and High-NA metrology

  • Yield collapses before defects are visible

This is why Ohio matters... Its grid and power topology were engineered before tools arrived

Backside power punishes weak infrastructure and Ohio eliminates that failure mode by design

Below 14A overlay margins collapse, line edge roughness dominates, and metrology confidence becomes fragile... At this scale:

• Infrastructure > process recipes

• Location > nominal capacity

Advanced 3D Packaging: The System Layer

Wafers do not create power - - Systems do

• Ohio One is a system factory, not a wafer island

Ohio is built around three packaging pillars that are treated as baseline infrastructure, not pilot lines or future add-ons:

• EMIB (Embedded Multi-die Interconnect Bridge)

• Foveros (3D vertical stacking)

• Integrated silicon photonics

These capabilities are assumed from inception

Industry movement toward glass-core substrates reflects the next packaging regime after ABF - - one that punishes weak infrastructure and only makes sense where large-scale, domestic system factories already exist

Advanced packaging has moved beyond the 75 mm class into 120 mm+ modules with 20+ layer stacks, turning substrates and warpage control into first-order yield constraints rather than backend optimizations

Recent execution stage work on glass core substrates integrated with EMIB confirms that Intel is already hardening the post-ABF packaging era - - a transition that only makes sense for them if a domestic, large scale system factory exists to absorb it... Ohio??

https://x.com/semivision_tw/status/2014195101908816108?s=20

EMIB enables chiplet sovereignty without interposers

It delivers high-bandwidth, low-latency die-to-die interconnect with higher yield than full silicon interposers.

Strategically EMIB:

• Enables heterogeneous integration

• Securely mixes defense, AI, and ISR dies

• Eliminates foreign interposer dependency

At Ohio EMIB is treated as first-order infrastructure not a specialty option

Foveros turns vertical control into security control

Logic-on-logic and logic-on-memory stacking enable power and signal isolation across layers — critical for:

• Space processors

• Hypersonic guidance systems

• Autonomous weapons compute

Ohio’s cooling and subfab geometry assume stacked-die thermals from day one

Photonics is the scaling escape hatch

Optical I/O at the package level enables massive bandwidth with lower power and secure, low-latency data movement

This is decisive for:

• AI training clusters

• ISR fusion platforms

• Jam-resistant communications

Ohio assumes photonics enabled chiplets

Why Ohio Was Engineered First as Infrastructure

Intel Ohio was engineered from the ground up as critical infrastructure

Ohio treats yield dependencies the same way the United States treats:

• nuclear naval shipyards

• strategic missile warning systems

• national laboratories

From the start:

• Power was overbuilt

• Cooling was oversized

• Subfab geometry was locked early

• Grid redundancy was embedded

Yield was assumed to be fragile and engineered accordingly

The Doctrinal Shift

The old model assumed that yield improves with time

The Genesis model assumes yield survives only with infrastructure

This is the foundational shift...

Yield is not a variable to be optimized later - - Yield is a property of the system’s ability to remain stable under stress

Why This Matters Strategically

Once yield is treated as infrastructure:

• Inland geography becomes a yield advantage

• Grid sovereignty becomes chip sovereignty

• Power stability becomes national security

• Survivability beats nominal efficiency

Ohio scales when other regions stall

Validation Authority

Silicon is useless until it is certified...

Ohio sits within direct reach of:

• defense validation

• autonomy testing

• ISR qualification

This compresses build → validate → deploy into a single inland loop

No coastal fab region controls its own validation clock and Ohio does

What Other Regions Do Not Have

Ohio is not just manufacturing silicon - - It validates and deploys it

This authority exists because validation is embedded upstream & not bolted on

Key enablers:

• Domestic control of upstream electronic materials

  • Glass cloth

  • Laminates

  • Specialty fibers

• Certifiable, auditable, expandable under U.S. jurisdiction

• Including Ohio-headquartered Owens Corning

Battelle Memorial Institute

Battelle is upstream

Battelle functions as:

• materials qualification authority

• failure mode validator

• classified system verifier

• nuclear, microelectronics, and ISR testbed

This allows Ohio to:

• validate silicon before volume

• certify systems without coastal dependency

• collapse prototype → deployment timelines

No coastal fab region possesses this authority layer

Wright-Patterson Air Force Base

Wright-Patt provides:

• ISR system certification

• Autonomy validation

• Defense electronics qualification

• Real-world deployment testing

It controls the validation clock

Nothing becomes operational in modern warfare until it’s validated. Wright-Patt is where:

• autonomy stacks are hardened

• ISR payloads are qualified

• EW systems are stress-tested

• classified silicon is certified

Wright-Patterson AFB is the heartbeat of U.S. defense in Ohio because it controls validation, and whoever controls validation controls time 

This anchors Ohio’s validation authority in operational reality

Air Force Research Laborator

AFRL does not build products. It:

• defines performance envelopes

• breaks systems under stress

• feeds requirements back into silicon, packaging, and power

National Air and Space Intelligence Center (NASIC)

NASIC:

• models Chinese & Russian systems

• reverse-engineers threat architectures

• sets the pace of counter-iteration

You cannot outrun an adversary you don’t model NASIC models them first

Ohio is home to the NASA Neil A. Armstrong Test Facility - - This facility has the world’s largest vacuum chamber, which SpaceX has used in the past to test Fairings and Starlink hardware

Why the Adversary Forces the Genesis Mission

The Genesis Mission is a counter strategy

The Adversary Reality the Old System Could Not Survive

America’s primary strategic competitors - - China and Russia do not separate:

• civilian industry

• military production

• logistics

• finance

• infrastructure

They operate under state directed fusion

That means:

• civilian fabs are wartime assets

• packaging lines convert instantly to weapons programs

• supply chains are treated as strategic terrain

• time is weaponized

A lot of people don't realize China builds all commercial ships military grade to flip into military assets at times of need..

The United States by contrast, optimized for efficiency and shareholder return assuming peace as a baseline

Genesis exists because that assumption no longer holds

How the Old Semiconductor System Actually Breaks

Semiconductor systems do not fail because fabs are destroyed... They fail when continuity breaks

The old semiconductor order and nearly every failed megaproject built within it collapsed through second-order failures, not direct attack

Those failures appear different on the surface, but they all trace back to the same structural mistake:

Critical dependencies were optimized for efficiency, not survivability

For decades, the United States routed its most important compute through a fragile external loop:

• Logic fabricated offshore

• Advanced packaging concentrated in East Asia

• Substrates controlled by Japan and Taiwan

• Logistics dependent on maritime lanes

• Defense silicon sharing commercial supply chains

This system works until pressure is applied

The Unified Failure Pattern

Every adversary strategy and every failed semiconductor megaproject exploits the same set of fragilities... The mechanism differs but the breakpoints are identical

Ohio exists because those breakpoints were engineered out

Continuity Collapse (Maritime, Logistics, Insurance)

Offshore semiconductor production depends on:

• Ports and shipping lanes

• Predictable maritime transit

• Shipping insurance and reinsurance

An adversary does not need a blockade
They only need:

• Insurance uncertainty

• Limited naval pressure

• Legal ambiguity

When insurers withdraw, throughput collapses without a shot fired

This same failure mode appears in civilian megaprojects when:

• Logistics costs spike

• Transit reliability degrades

• Risk becomes uninsurable

Why Ohio survives

Ohio removes the vector entirely:

• No ports

• No maritime insurance dependency

• No naval leverage

This failure mode does not exist inland

Conversion Bottlenecks (Packaging, OSATs, Substrates)

As substrates scale, control of ABF films and reinforced glass cloth has become a rate-limiting factor, with pricing actions by suppliers like Nittobo underscoring the fragility of offshore material concentration

Even if wafers survive, advanced systems still require:

• Offshore substrates

• Asian OSAT packaging

• Foreign queue priority

An adversary only needs to:

• Delay packaging

• Prioritize domestic military programs

• Disrupt substrate flows

This does not halt fabrication.. it freezes iteration speed

Megaprojects fail here too:

• Wafers ramp

• Packaging lags

• System-level yield collapses

Why Ohio survives

Ohio was never designed as a wafer island

• EMIB and Foveros were assumed from inception

• Packaging treated as infrastructure, not a follow-on

• Substrate supply moved inland upstream

Ohio collapses wafer → system conversion inside U.S. jurisdiction

Authority Fracture (Certification, Validation, Control)

Modern weapons systems do not ship when built - They ship when certified

Offshore production fractures validation across:

• Foreign fabs

• Foreign OSATs

• Distributed audit chains

Under escalation, certification timelines stretch or halt.

Megaprojects fail the same way when:

• Compliance authority is external

• Validation becomes political

• Control is delayed by audit bottlenecks

Why Ohio survives

Ohio embeds validation upstream:

• Defense, autonomy, and ISR qualification remain local

• Certification timelines stay under U.S. control

Infrastructure Instability (Power, Water, Yield)

At advanced nodes, fabs fail on infrastructure before yield:

• Grid upgrades lag construction

• Power quality degrades metrology

• Water constraints cap expansion

Megaprojects collapse when:

• Utilities become contested

• Power becomes variable

• Expansion triggers redesign

Why Ohio survives

Ohio was engineered for fragility tolerance:

• Dual-grid access (PJM + MISO)

• Dedicated 500kV transmission

• Power built ahead of tool demand

• Stable water and climate envelope

Ohio does not compete for power since the power was reserved

Capital Withdrawal (Financial Fragility Under Stress)

Industrial systems fail when capital loses confidence.

In crisis:

• War-risk insurance voids

• Reinsurance pulls back

• Financing freezes

• Lenders hesitate

Coastal, logistics-dependent systems stall.

Megaproject ecosystems fail here when:

• Banks de-risk

• CapEx pauses

• Supplier layers hollow out

Why Ohio survives

Ohio remains financeable under stress:

• Inland assets stay insurable

• No port exposure exists

• Defense-aligned underwriting persists

• Capital continuity is preserved

SVB didn’t just kill startups - - it killed fragile ecosystems & Ohio rebuilt the financial layer to survive stress

Why Inland Geography is a Defense Layer

Ohio was chosen because of its geography

Inland geography removes entire adversary toolkits:

Ohio is a deliberately engineered INLAND system

Power, compute, manufacturing, validation, logistics, workforce, and finance are all co-located and synchronized.. This is what allows Ohio to scale when other regions stall

https://siliconheartland.newalbanyohio.org/

https://www.google.com/maps/d/u/0/edit?mid=1Muq4_eZtYHURmg78QgLH_V1pg1DWz7M&ll=39.79314523024715%2C-84.41518606387737&z=8

Logistics Hardening Is Part of the Ohio Doctrine

Ohio’s role as an inland control plane is reinforced not only by fabs and grids, but by deliberate freight survivability upgrades

The Brent Spence Bridge is one of the most overloaded freight chokepoints in the U.S., linking the Midwest industrial base to southern logistics corridors

• being fully rebuilt under a $4B federal-state program

This corridor carries:

• Defense suppliers

• Substrates

• Heavy equipment

• Chemicals

• System-level components

Hardening this route removes a single-point failure between:

• Midwest manufacturing

• Ohio system conversion

• Southern deployment and port alternatives

This is not traffic relief its simply logistics continuity under escalation

The Adversary Test

Every serious strategic system must pass a simple test:

"How does an adversary actually break this?"

For Ohio the answers are limited:

• Naval blockade → irrelevant

• Export controls → already internalized

• Packaging disruption → inland

• Insurance withdrawal → minimal

• Capital pressure → defense-aligned

• Workforce evacuation → low risk

• Logistics disruption → domestic truck & rail

What remains?

Only direct physical attack... which is a massive challenged in itself

That is an entirely different escalation ladder and one adversaries avoid unless absolutely necessary

Ohio survives first contact

What Could Actually Break Ohio & Why it Hasn't

Every real strategic system has failure modes
Pretending otherwise is how things collapse

Ohio’s risks are real but bounded

None of them interrupt continuity - - they only constrain the rate of expansion - - Ohio was engineered for that reality

Risk 1 - - High-NA EUV Tool Dependency

Reality: High-NA EUV tools are built overseas and represent irreplaceable capital assets

Why this doesn’t break Ohio:
Once installed, survivability depends on location not logistics

• Tool shipment slows everywhere in crisis

• Inland fabs continue operating

• Coastal regions face insurance withdrawal, port disruption, and workforce shock

High-NA EUV is a front-loaded dependency

After installation continuity is geographic - - Ohio was selected to keep running when ports, shipping, and reinsurance freeze

Risk 2 - - Specialty Gases & Chemicals

Reality: Neon, helium, photoresists, and specialty chemicals remain globally sourced

Why this doesn’t break Ohio:

• Defense-aligned fabs receive priority allocation under escalation

• Inland sites support bulk storage and longer buffer cycles

• Domestic substitution is already active under export-control regimes

In conflict commercial offshore fabs pause first while defense-aligned inland fabs are sustained

Risk 3 - - Cyber / Insider / Sabotage

Reality: Physical survivability alone is insufficient at advanced nodes

Why this doesn’t break Ohio:

• Secure enclave architecture separates classified and commercial lanes

• Physical segmentation of tools, subfabs, and utilities

• Air-gapped defense networks with continuous DoD oversight

This structure cannot be retrofitted into offshore OSAT or shared-utility fabs. Ohio was built with it from inception

The Quiet Resilience Layers

Most megaprojects fail under stress not because the tech breaks but because the supporting systems collapse - Ohio was engineered to survive those failure modes

layers most analysts never model:

• EUV tools and fab assets remain fully insurable and reinsurable

• Subsurface and mineral rights are secured for decades, not cycles

• Export-control frameworks allow immediate segmentation for classified workloads

• Tier-4 supplier security hardens passives, laminates, and ceramics

• Regional emergency response is sized for HF, arsine, and cryogenic incidents

These are the details that determine whether a site shuts down or keeps running
They are invisible until crisis arrives

Why This Section Matters

This is the phase where megaprojects usually unravel

• Capital loses patience

• Talent rotates out

• Policy shifts

• Infrastructure stalls

Ohio does not show these failure signatures

Instead:

• Capital is aligned across commercial and defense timelines

• Talent is migrating into design enablement and long horizon roles

• Policy is converging rather than oscillating

• Physical infrastructure has crossed the point of irreversibility

Strategic Synthesis

Ohio

Ohio is not winning a competition - its closing a loop

What now exists inside a single inland region is a complete and durable system of national power

The Closed Loop

Within roughly a fifty mile radius the United States has assembled:

• Leading edge logic fabrication at national scale

• Advanced 3D packaging and chiplet integration

• An inland substrate conversion pipeline

• Hyperscale cloud adjacency and demand

• Autonomous weapons manufacturing at rate production

• Military R&D validation and certification

• Propulsion and power electronics engineering

• A hardened national scale grid

• Defense aligned industrial finance

No other region in the world contains all of these layers in one operational loop

How the System Feeds Itself

Each layer pulls the next into inevitability:

• Intel Ohio creates domestic leading edge supply

• Packaging and substrates turn wafers into systems

• Defense and cloud absorb volume and stabilize demand

• Autonomy factories convert compute into weapons

• Military validation hardens systems for deployment

• Finance underwrites scale without fragility

• Policy locks participation inside US borders

Once operating it reinforces itself

Why This Is Different From Past Megaprojects

Most industrial projects depend on one pillar
Ohio depends on many:

• Not just subsidies but procurement mandates

• Not just fabs but packaging and substrates

• Not just defense but hyperscale demand

• Not just construction but design inevitability

• Not just policy but finance and insurance

Remove one pillar and the system still stands

What Ohio Replaces and What It Does Not

Ohio does not replace Taiwan in consumer volume...
It replaces Taiwan in the domains that determine sovereignty

• Secure advanced packaging

• Classified tape out

• Defense and autonomy compute

• Inland survivability

• Auditable supply chains

Arizona fabricates - Taiwan manufactures - Ohio controls what becomes operational when optimization fails

The Strategic Outcome

For the first time since the Cold War the United States has rebuilt:

• A sovereign silicon core

• A domestic weapons compute pipeline

• A resilient industrial finance layer

• A manufacturing system that can operate under stress

This is the foundation for:

• Next-generation air dominance

• Collaborative combat aircraft

• Missile defense and sensor networks

• Hypersonics

• Space-based ISR

• Autonomous warfare

Time is the Strategic Variable

Modern conflict is decided by:

• sensor → silicon → deployment loops

• autonomy refresh cycles

• countermeasure response time

Capacity matters but continuity determines time - - - and time determines force

Ohio collapses iteration loops inland so what takes years offshore compresses into quarters

The system that keeps producing at reduced efficiency defeats the system that halts at peak efficiency

Irreversability

To replicate Ohio today would require:

• years of grid permitting

• new transmission corridors

• water rights

• subfab zoning

• defense validation authority

• cleared workforce pipelines

This is the moment the United States stopped optimizing supply chains and started hardening systems because Ohio is not an industrial bet as its a survivability decision

Intel execution risk exists 100% especially with their past records BUT that was pre Lip-Bu Tan..
Ohio’s value persists even if timelines slip

Genesis Is a National System - - Not an Intel Bet

Intel executes Ohio but Genesis does not depend on Intel perfection

Execution risk exists as it always does at this scale

The value of Ohio persists even if:

• node ramps slip

• yields mature more slowly than projected

• timelines extend beyond conservative guidance

Because Genesis embeds capabilities that outlive any single node, roadmap, or management cycle:

• substrate and packaging gravity

• inland power and water sovereignty

• secure validation and certification authority

• design enablement upstream of manufacturing

• defense-aligned demand that cannot migrate offshore

These assets outlive any single node or management cycle

Intel’s past execution issues occurred under a model optimized for efficiency, outsourcing, and financial engineering

Under Lip-Bu Tan, Intel is reorganizing around design inevitability first, capacity second, mirroring the Cadence playbook where outcomes are locked before manufacturing begins

Even if Intel underperforms at the margin, Ohio remains the only U.S. site where:

• advanced logic

• advanced packaging

• secure tape-out

• domestic validation

• and escalation-resilient continuity

can coexist at scale

The Unspoken National Security Unlock

If Intel Ohio incorporates even partial on site substrate capability in future phases:

• America’s final semiconductor chokepoint closes completely

• Full domestic advanced packaging returns

• Chiplets, photonics, and secure packaging scale entirely inside U.S. borders

This eliminates the Pentagon’s last silicon supply chain exposure to Asia

Ohio Doctrine: Control Plane vs Fab

Ohio is not competing with Arizona or Taiwan.. its It is replacing them in the domains that determine power under stress

A control plane is authority over:

• design acceptance

• certification timelines

• deployment readiness

• iteration speed under disruption

In wartime the system that decides “what ships” wins.. not the system that fabricates the most wafers

History has seen this pattern before:

• Pittsburgh during the steel era

• Detroit during the combustion engine era

• Los Alamos during the Manhattan Project

Ohio is next

• Power shifts from efficiency to survivability

• Control beats capacity in wartime

• Ohio is built to function when optimization fails

Anchored by Intel’s $28B plus Ohio One megafab the state is

being quietly reconfigured into the sovereign core of Americas semiconductor defense autonomy and

cloud infrastructure

So What is Intel Ohio?

Ohio One Is Not a Fab

It Is a System Factory

Intel’s Ohio One is an engineered national security system built within a single inland region

Within Ohio the United States is rebuilding

• Leading edge logic

• Advanced 3D packaging

• Substrate sovereignty

• Hyperscale cloud adjacency

• Autonomous weapons manufacturing

• Military validation and certification

• Defense aligned industrial finance

Ohio One specifically:

• leading edge logic

• advanced 3D packaging

• Secure Enclave production

• continuous classified throughput

Nothing here is retrofitted.... Nothing is phased in later.,.. all built in from the start

Scale Is Already Embedded

Ohio One’s importance lies less in announced fab counts than in infrastructure assumptions

Declared investment:

• $28B+ initial capital

Physical reality:

• Two megafabs under construction

• Civil geometry and utilities sized for 8–10 fabs

• Future advanced packaging facilities already accounted for

• Substrate integration anticipated, not retrofitted

Paused projects do not look like this.. systems built to absorb demand shocks do

They do not:

• overbuild utilities

• lock multi-fab geometry early

• size infrastructure for demand they do not yet “have”

Ohio was designed to absorb demand shocks

From Doctrine to Steel

Civil geometry, power routing, subfab depth, and cleanroom physics

Every strategic claim above has a physical analog already built:

• Survivability - - inland siting, dual-grid power

• Sovereignty - - Secure Enclave integration

• Scale - - utility oversizing

• Irreversibility - - shell lock & subfab sealing

• Defense alignment - - classified manufacturing lanes

This system has already crossed the point of no return

Phases of Ohio One

Trust the Ground not the Press

Genesis does not announce itself because it reveals itself structurally in phases

Most observers watch:

• Press releases

• Hiring headlines

• CapEx guidance

They miss where the truth actually is:

• Concrete

• Steel

• Power topology

• Subfab geometry

remember that the ground tells the truth

Phase I - The Physical Lock-in (COMPLETED)

The Point of No Return

Paused semiconductor projects leave obvious signatures & Intel Ohio does not show them

Paused projects do not:

• Overbuild utilities

• Seal subfabs

• Install cleanroom decks

• Activate permanent substations

Ohio has done all four...

Observed facts:

• Utilities built ahead of tool demand

• Subfabs sealed before anchor customers are announced

• Cleanroom decks installed before yield teams arrive

At this stage:

• Capital is sunk

• Design assumptions are embedded

• Reversal becomes politically and economically irrational

This is the irreversibility threshold that Ohio has crossed

Multi-Module Commitment Is Already Visible

Second fab module is already above ground

• The vertical pillars now visible are the permanent structure behind the hoisted cleanroom slabs of Module 1

First module is expected to be fully shelled this year

This confirms:

• Multi-module concurrency

• No serialized “wait and see” build

• Structural commitment beyond a two-fab narrative

You do not raise permanent vertical structure for follow-on modules unless expansion is assumed

Why This Is Not a “Two Fab” Build

Intel Ohio is not being constructed like a simple dual fab campus

The site shows signals of parallel, scalable deployment:

A two-fab site does not require:

• Multi-hundred-MW substations

• Multi-story fab shells locked early

• Redundant UPW farms

• Early cleanroom decks & roof panels

• Multiple large gas pads

• Deep, compartmentalized subfabs sized for parallel tool clusters

• Crane density indicating parallel sequencing

• Excess exhaust handling capacity

• Central utility plants sized for continuous multi-fab operation

Again, Ohio has all of them

Utilities are built ahead of need, not just in time
You do not prebuild permanent infrastructure at this scale if you intend to pause

Subfab Geometry: Built for What Comes Next

Ohio’s subfabs are:

• Deeper

• Wider

• Heavier reinforced

Than required for 18A alone

This geometry matches High-NA EUV era requirements not transitional nodes

Arizona required redesigns to reach this standard
Ohio was built to it from day one

That signals expectation of next-generation tools

Cleanroom & Shell Signals

Same cleanroom footprint as Fab 52/62 and Fab 38

• Majority of cleanroom floor installed

• Minimal column count confirmed

• Long-span design optimized for tool flexibility

• Floor systems aligned for EUV-class vibration tolerance

Once cleanroom decks go in:

• Layout assumptions are frozen

• Tool intent is implicit

You do not do this without intent to run tools

Interstitial & Shell Completion Path

• Interstitial framing underway above cleanroom

• Fan deck systems staged for airflow, thermal, and humidity control

• Roof truss lifts complete the envelope (“shell”)

Shell completion = transition from construction to activation
Ohio is on this path now

Early EUV Readiness Signals

Cryogenics + vibration isolation appeared early not late

Visible signals:

• Cryogenic-capable routing corridors

• Gas and cooling envelopes sized for sustained EUV duty cycles

• Vibration-isolated corridors for parallel EUV tools

• Transport spacing optimized for environmental decoupling

This implies:

• EUV readiness baked into civil design

• High duty-cycle assumptions

• Earlier tool move-in than conservative guidance suggests

Electrical Backbone = Operational Scale

This is not construction power

Signals:

• Permanent switchgear

• Dense transformer populations

• Hardened routing corridors

• Substations activating with shell completion

• Primary duct trunks, mains piping installed

• Chiller and compressor zones structurally complete

Temporary power does not look like this
This is operational infrastructure sized for future fabs

Phase I In Short

All signals align under one assumption:

• Utilities assume expansion

• Subfab geometry assumes High-NA

• Tool readiness assumes sustained throughput

• Power systems assume real load

Paused projects are not built this way

Phase II - - Design Gravity (IN PROGRESS)

Once physical lock-in occurs, design gravity follows

Phase II is not visible in steel but its visible in design behavior

At this stage:

• Design enablement moves upstream of manufacturing

• Packaging and power assumptions lock before demand is public

• Programs quietly align to one physical reality

This is where fabs stop competing on price or schedules
and begin competing on architectural inevitability

Designs are being trained on:

• High-NA EUV envelopes

• Backside power assumptions

• EMIB / Foveros constraints

• Inland validation timelines

Fab selection becomes implicit

Design Gravity Precedes Wafer Gravity

Foundries do not win customers at tape-out...
They win years earlier inside design flows

Once engineers train on:

• Intel PDKs (18A → 14A-class)

• backside power (PowerVia) constraints

• EMIB / Foveros packaging rules

• High-NA EUV layout envelopes

• inland validation timelines

Switching fabs becomes a design rewrite not a procurement choice

Ohio is now exerting that pull

What Phase II Looks Like in Practice

• Defense and hyperscale architectures are being shaped around Ohio constraints

• Packaging is treated as a first-order design variable, not a downstream step

• Validation timelines are assumed domestic and inland

• Secure enclave compatibility is designed in

Programs are no longer “bid into Ohio.”
They are designed assuming Ohio exists

Phase III - - Demand Ignition (PENDING)

Genesis does not scale linearly
It ignites

Trigger conditions:

• First $1B+ external commitment tied to domestic 14A-class wafers

• Defense or hyperscale volume activation

• Policy or geopolitical shock collapsing alternatives

The igniter can be:

• a defense sustainment contract

• a hyperscaler capacity reservation

• a policy or geopolitical shock collapsing offshore alternatives

When triggered:

• Fab 3 / Fab 4 unlock immediately

• Federal capital accelerates

• Hyperscalers panic-reserve domestic capacity

From the outside it looks sudden but in reality it’s delayed recognition of infrastructure already built

Phase IV - - Strategic Irreversibility

At Phase IV:

• Workforce gravity locks

• Infrastructure reservations harden

• Design flows train on a single system

Ohio stops being a project & it becomes infrastructure

Reversal is no longer a business decision & becomes a national disruption event

All in All

• Subfab depths exceed 18A needs

• Clean subfab structure largely complete

• Gas, liquid, waste, exhaust laterals defined

• Power, pump, transformer zones framed

• Column spacing widened for EUV density

• Vibration isolation sized for parallel tools

• Cryogenic routing exceeds transitional requirements

Arizona retrofitted and Ohio was built right the first time

That is confidence poured into concrete

Phase I is done
Phase II is underway
Phase III awaits ignition
Phase IV is structurally forced under escalation

Most people are watching announcements while the ground already decided

High-NA EUV and Continuity

Why Ohio Was Chosen to Keep Running

High-NA EUV is the final physics gate of advanced logic

Ohio’s civil envelope supports:

• parallel EUV clusters

• sustained duty cycles

• long-term installed-base survivability

High-NA is a front-loaded dependency
Once installed survivability depends on location not future tool deliveries

Ohio was selected to keep running when:

• ports freeze

• shipping insurance collapses

• reinsurance withdraws

Full EUV / High-NA Production Compatibility (By Design)

Long before any tool delivery, Ohio’s physical layout signals intent:

• tool bays sized for ASML NXE + EXE

• subfabs engineered for cryogenic hydrogen handling

• dedicated neon / argon / nitrogen corridors

• sub-nanometer vibration envelopes

• mask & pellicle zones sized for defense-relevant volume

High-NA geometry is already embedded:

• 300+ ton scanner floor loads

• column-optic ceiling heights

• beam-path clearance across full envelopes

• ultra-tight thermal expansion control

This eliminates:

• demolition risk

• retrofit downtime

• capacity loss during node transitions

Ohio is structurally a High-NA generation site

Packaging & Substrates

Leading edge transistors are no longer the bottleneck in advanced systems.. Packaging is

Wafers do not create power... Systems do

Every modern compute system depends on advanced substrates to physically connect logic memory power and I/O into a usable system

Every advanced system depends on substrates:

• AI accelerators

• missile seekers

• ISR payloads

• autonomy compute

• space processors

Without substrates, wafers are useless

Packaging Is Where Sovereignty Is Lost

Advanced systems do not fail at the wafer they fail at the conversion layer

Packaging determines:

• power density

• thermal survivability

• latency and signal integrity

• radiation tolerance

• system-level yield

For decades, the United States allowed this layer to remain offshore

That decision quietly nullified fabrication sovereignty

Genesis restores sovereignty by relocating the system assembly layer inland

The Historic U.S. Vulnerability

The United States historically lacked:

• domestic advanced substrate capacity

• domestic large-scale advanced packaging

This meant:

• iteration speed was externally gated

• defense timelines were fragile

• escalation collapsed supply chains

Genesis exists to close this gap

Substrate Chokepoint

Even if Intel builds the world’s best transistors nothing works without substrates

• The United States has no modern domestic ABF substrate capacity

• Global supply is controlled by:

  • Ajinomoto (Japan)

  • Unimicron / Nan Ya (Taiwan)

This means:

• AI compute

• Hypersonic guidance

• ISR refresh cycles

• Autonomous weapons

…all remain externally rate limited without inland correction

Control of substrates = control of time

Substrate sovereignty is often framed around ABF resin and panel capacity

But even perfect ABF chemistry fails without glass cloth capable of maintaining dielectric performance at GHz+ signaling speeds

Today this remains a global chokepoint led by Japan & under escalation the U.S. strategy is controlled convergence

• where trusted domestic platforms like Owens Corning / AGY provide the base upon which performance parity can be subsidized, mandated, and eventually forced

The Midwest Substrate Correction

The United States is quietly correcting this failure... again, inland

SCHMID Group and Calumet Electronics in Michigan are building America’s first modern high-density organic substrate capability, roughly 500 miles from Intel Ohio One, connected entirely by truck and rail.

Capabilities include:

• high-density organic substrates

• large-panel formats optimized for chiplets

• glass substrate pilot lines

• redistribution layers and hybrid interposers

• materials compatible with EMIB and Foveros

This creates the Ohio–Michigan Axis

The Ohio-Michigan Axis

• Michigan produces substrates

• Ohio converts them into systems

This creates the first inland end to end chiplet pipeline in U.S. history:

• Substrates produced inland

• Dies packaged inland

• Systems provisioned inland

• Logistics fully domestic

No maritime choke points

Geography becomes defense

Conversion Point

Substrates do not create power - Packaging does

Ohio One is where substrates become

• EMIB connected chiplets

• Foveros stacked systems

• Photonics enabled packages

• Secure defense grade assemblies

Without Ohio the Midwest substrate effort stalls - - without substrates Ohio can not scale

EDA: Upstream Control Panel

Semiconductor power does not begin in fabs it begins inside Electronic Design Automation (EDA) tools

EDA determines:

• what architectures are feasible

• what power delivery schemes can be verified

• what packaging geometries are realistic

• what yield risks are tolerable

Foundries win customers years before tape-out.. inside EDA flows

Why Manufacturing Alone Is Not Enough

EDA dominance alone is insufficient if manufacturing is offshore

Design intent fractures when:

• foundry rules are foreign

• packaging constraints are external

• validation is overseas

• secure flows are unauditable

The Cadence → Intel Signal

Leadership lineage matters because design gravity precedes manufacturing gravity

Lip-Bu Tan’s background at Cadence matters because Cadence is where semiconductor outcomes are decided long before wafers exist

Cadence is where:

• design constraints become non-negotiable

• defense and aerospace architectures are frozen

• packaging, power, and validation assumptions are locked

• fab selection becomes implicit years before procurement

Foundries do not win at the fab they win inside EDA flows before tape-out is even possible

Under Lip-Bu Tan, Cadence mastered a specific pattern:

• shape architectures before capacity exists

• embed constraints upstream

• make switching costs architectural, not contractual

Intel is now applying that same pattern to manufacturing

Intel’s move to pull defense and government focused design enablement upstream signals:

• shaping demand before capacity unlocks

• embedding Intel rules before tape-out

• designing Ohio into programs rather than bidding later

Why This Matters for Ignition

Ignition does not begin with wafer orders
It begins when architectures become dependent on a single system

Once programs are designed around:

• Intel PDKs

• PowerVia assumptions

• EMIB / Foveros constraints

• enclave-grade validation timelines

Demand does not need to be sold

The Ignition Event

The First $1B+ External Customer

It is the first $1B+ multi-year external commitment tied explicitly to domestic 14A-class wafer capacity

That moment flips Intel Ohio One from 2 fabs under construction to America's engine

The system was designed assuming:

• Demand arrives suddenly

• Not gradually

Ignition IS:

• the first $1B+ multi-year external commitment

• explicitly tied to domestic 14A-class capacity

• made before proof, because alternatives are constrained

Ignition is a financial recognition event not a manufacturing milestone

Once ignition occurs, three things happen automatically:

Capital unlocks

• CHIPS expansion clauses activate

• lease-back / co-investment structures reopen

• federal risk underwriting collapses

Capacity accelerates

• Fab 3 / Fab 4 greenlit

• tooling timelines compress

• Ohio shifts from staged to parallel build

Demand cascades

• hyperscalers panic-reserve domestic slots

• defense primes align future tape-outs inland

• Ohio moves from optional to mandatory

This is how Ohio goes 2 → 4 → 8 fabs inside ~36 months

Who Can Ignite Ohio

Not everyone can.. the igniter must satisfy all four conditions:

• Can write a $1B+ check

• Needs leading edge + packaging

• Benefits specifically from U.S. domestic wafers

• Can move before others without waiting for proof

realistically only 4 options exist..

Hyperscaler Custom Silicon

AWS (Primary Igniter??)

Amazon Web Services is the single strongest candidate

• Already engaged with Intel Foundry at 18A

• TSMC N2 capacity is functionally booked (Apple / NVIDIA / AMD / Broadcom)

• Trainium / Inferentia roadmaps require predictable wafer access

Structural forces favor domestic capacity:

• Tariff exposure + CHIPS economics structurally favor domestic wafers

• GovCloud + defense workloads increasingly require auditable supply chains

• Geographic redundancy is now a requirement, not an optimization

AWS operates one of its largest global regions in Ohio, anchored in the Columbus metro, placing massive, immediately consumable demand inside the same inland basin as Intel Ohio One

That proximity matters because it enables:

• Faster silicon-to-deployment loops

• Lower logistics, risk, and inventory overhead

• Early capacity reservation without waiting for global manufacturing proof

AWS does not require the lowest possible cost or perfect early yields
AWS does require guaranteed domestic supply, geographic redundancy, and capacity it can consume locally

AWS is the only hyperscaler positioned to ignite Ohio first and immediately pull capacity into real utilization

Microsoft Azure

Azure’s strategic strengths are real:

• Deep Department of Defense and intelligence community integration

• Custom silicon roadmaps (Maia, Cobalt)

• Longstanding Intel relationship

• Significant federal and classified cloud demand

Microsoft has paused portions of its Ohio data center expansion due to capex so its less likely to be them as a launch customer but they'll be a quick follower

Azure typically:

• Waits for manufacturing proof points

• Lets supply chains mature

• Commits after economics stabilize

Azure is more likely to:

• Commit immediately after AWS or DoD ignition

• Reserve large blocks once Ohio capacity is visibly real

historically more cautious on first wave capex

U.S. Department of Defense (Classified Wafer Sustainment)

This is the most underestimated ignition path because it doesn’t look like a “customer” on the surface but structurally it behaves like one

The DoD does not need:

• Lowest unit cost

• Consumer-scale yields

• Public announcements

The DoD does need:

• Guaranteed domestic, classified, leading-edge wafers

• Multi-year availability under escalation

• Secure tape-out and advanced packaging entirely within U.S. borders

That maps exactly to Intel Ohio One

A DoD ignition would not look like a traditional commercial deal. It would likely take the form of a 10–15 year classified sustainment contract explicitly tied to 14A-class secure wafer capacity covering:

• Hypersonic guidance processors

• Missile seekers

• ISR payload compute

• Autonomy and teaming processors

• Space and counter-ISR systems

A single agreement of this type would instantly:

• Justify Fab 3 and Fab 4

• Force dedicated secure packaging capacity

• Lock Ohio as the compute anchor for Golden Dome, NGAD, and Replicator

This would not show up as “Intel wins customer X.”
It would show up as: “DoD expands domestic advanced microelectronics capacity under RAMP-C.” type thing

RAMP-C already mandates:

• Domestic tape-out

• Secure packaging

• Auditable supply chains

Classified programs cannot wait for commercial yield perfection

DoD doesn’t follow hyperscalers it moves when risk crosses tolerance

AMD & OHIO: Pressure Valve Signal

AMD does not need to switch foundries for Intel Ohio to matter
It only needs to prepare for Intel specific process realities

AMD is one of the most demanding fabless designers in the world
If a process is not credible, AMD does not train for it

AMD is not:

• Building fabs in Ohio

• Abandoning TSMC

• Becoming an anchor customer

AMD is applying pressure to:

• Node availability

• Geographic concentration risk

• Packaging and power constraints

That pressure bends toward Ohio

The PowerVia Signal

AMD has posted physical design / CAD roles listing backside power delivery and 3D stack concepts as preferred experience

Backside power is not a generic industry abstraction

It exists only inside:

• Intel 18A / 14A-class processes

• Intel Foundry Services

• Fabs physically designed for PowerVia

Companies do not train engineers for manufacturing architectures they do not expect to encounter

This confirms three things simultaneously:

• Intel’s process roadmap is being treated as real

• Backside power constraints are entering AMD’s design reality

• Intel Foundry is credible enough to warrant internal readiness

This is process level validation

Why AMD Is Structurally Forced to Care

AMD’s exposure is concentrated exactly where Ohio matters most:

• Chiplet-based CPUs and GPUs

• AI accelerators

• Defense-adjacent compute

• Hyperscaler custom silicon

All four are:

• Packaging-constrained

• Power-delivery-constrained

• Iteration-speed-constrained

Ohio is the only U.S. site engineered for what comes after TSMC N3/N2 saturation:

• Backside power

• Large-scale advanced packaging

• Secure domestic conversion paths

AMD does not need flagship volume for Ohio to matter because the optionality itself is leverage

Where AMD Would Actually Touch Ohio

• Advanced packaging - chiplet integration

  • EMIB

  • Foveros

  • Photonics-enabled packages

  • Future glass substrates

• U.S. only / defense adjacent SKUs

  • Domestic packaging

  • ITAR compliant flows

  • Secure validation

AMD involvement does three things:

• Validates Intel Foundry physics

• Signals hyperscalers that Ohio is real

• Accelerates defense confidence in domestic nodes

AMD’s role is credibility pressure

Fab Workforce Reality - - - The Three Waves

The human signals mirror the physical signals exactly

Intel builds megafabs in three distinct workforce waves

Wave One: Political, Permitting, Subsurface (2022–2024)
Land acquisition, wetlands mitigation, mineral rights, PUCO power filings, Army Corps water approvals, and local incentive structures
These leaders exit once the ground is locked. Their departure signals completion, not slowdown

Wave Two: Heavy Civil & Structural (2023–2025)
Subfab excavation, cryogenic vaulting, utility trenching, vibration-isolated foundations, and cleanroom shell erection
Managers transition out as shells seal and subfabs are commissioned

Wave Three: Tools, Process, Yield (2026–2030)
EUV / High-NA integration leads, lithography tuning specialists, metrology owners, yield ramp teams, and secure enclave certifiers
These $400K–$900K specialists do not relocate until cleanrooms are pressurized and tool bays are certified

Most observers are mistakenly waiting for Wave Three to appear before believing the project is real

Ohio Versus Arizona - Timing Reality

Key points:

• Arizona = volume + commercial scaling

• Ohio = control + continuity

• Ohio is where:

  • New nodes are hardened

  • Sensitive customers anchor

  • Validation clocks are owned, not borrowed

Arizona is inland by geography - Ohio is inland by survivability

Why Slowing Now Makes No Sense

Despite all the rumors that Ohio One is being delayed .. its all smoke..

Pausing now would:

• Strand billions in fixed infrastructure

• Permanently damage foundry credibility

• Break defense alignment under RAMP-C

• Undermine hyperscaler confidence

• Trigger congressional and Pentagon intervention

The rational move is not delay - - It is acceleration once demand is formalized

Personnel Turnover - Why Departures Are Normal at This Phase

Recent reporting has highlighted local leadership turnover tied to Ohio One

• Several “local Intel leaders” tied to the Ohio One project left around September 2025

Reported departures include:

• Toby Starr - public affairs manager

• Sanjay Patel - construction-site manager

• Tom Marshall - senior program manager (Foundry division)

• Kevin Hoggatt - described as a “main lobbyist / government-relations lead” for Ohio One

• Ronak Singhal - a senior-fellow / Xeon CPU chief architect - - was also leaving the company in September 2025

The cluster created the illusion of a systemic problem but the roles fall into three predictable end of phase categories:

Government / Community Liaison Roles

• zoning & land use negotiations

• EPA & Army Corps environmental compliance

• workforce grants

• tax abatements

• regional political coordination

• These roles evaporate once political & regulatory gates close

Heavy Civil Site-Development Managers

• subfab excavation

• stormwater systems

• utility corridor routing

• crane pathways

• perimeter access roads

Their job ends when subsurface work is complete

Early Construction Integration Leads

• shell sequencing

• contractor coordination

• early safety & structural QA

• cleanroom envelope erection

They transition out when shells seal and internal MEP takes over

Why September Looked “Sudden” to the Public

Three things converged at once:

• Shell + subfab civil milestones were reached

• Local political roles expired at phase gates

• Contractor transitions masked as “Intel exits”

Defense & Cloud Demand Are Inevitable

Once substrates & packaging moves inland everything upstream follows

• Hyperscale cloud demand

• Defense production scale

• Autonomy manufacturing

• Secure logistics

• Capital formation

Demand from defense and cloud is a matter of when

Defense and hyperscalers are not optional customers.. They are forced participants once constraints activate

Structural Demand, Not Cyclical Demand

Structural demand has three defining properties:

• Appears when alternatives fail

• Persists regardless of price

• Is governed by compliance and survivability

This is fundamentally different from cyclical semiconductor demand.

Cyclical demand:

• Appears when prices fall

• Disappears when margins compress

• Migrates to the lowest-cost geography

Structural demand:

• Appears when alternatives collapse

• Persists regardless of pricing

• Is locked by regulation, security, and continuity

Once buyers evaluate whether they can legally, securely, and reliably deploy advanced systems without Ohio, demand stops fluctuating:

• Demand does not migrate offshore

• Demand does not wait for “better timing”

• Demand activates when constraints activate

Defense and cloud do not choose Ohio because it is cheaper
They choose Ohio because the alternative paths collapse

Why Defense Can’t Stay Offshore

For decades, U.S. defense silicon tolerated offshore dependencies:

• Taiwanese foundries

• Asian OSAT packaging

• Maritime logistics

That tolerance no longer exists.

Geopolitical risk has collapsed the margin for offshore dependence:

• Taiwan concentration risk

• Export-control bifurcation

• Wartime surge requirements

• Classified workflow isolation

The U.S. Department of Defense now mandates:

• Domestic wafer production

• Domestic advanced packaging

• Secure enclave manufacturing

• ITAR-controlled flows

• Auditable, escalation-resilient supply chains

Intel Ohio One is the only site designed to potentially satisfy all five at scale

Once the Michigan → Ohio flow becomes standard, the U.S. defense silicon stack becomes fully domestic and sovereign by default

When Structural Demand Pulls Consumer Optionality Inward

Apple, Intel Ohio, and the Consumer Multiplier

Intel Ohio does not require consumer OEM participation to succeed...
But once sovereign packaging, substrates, and inland capacity exist, consumer supply chains gain a new option they have never had before

A December 2025 MacRumors report suggests Intel may manufacture future iPhone chips in the United States - - https://www.macrumors.com/2025/12/05/intel-iphone-chips-rumor/

If even partially true the implications are structural

Not because Apple validates Ohio but because Ohio finally makes domestic consumer silicon feasible

A hypothetical Apple pipeline would look like:

• Glass → Kentucky (Corning Harrodsburg)

• Logic → Intel Ohio One (14A)

• Packaging → Ohio Two (EMIB Foveros glass substrates)

• Logistics → Rickenbacker Global Hub

• Assembly → Interior U.S. states

This configuration eliminates:

• maritime chokepoints

• China exposure

• offshore packaging risk

• export control ambiguity

It would be the first time Apple could source leading edge A series silicon entirely within U.S. borders

The key point is this:

Ohio is the first place where such a decision is even possible

Why Consumer Optionality Is Secondary to Warfighting Reality

Consumer silicon may follow Ohio but Warfighting doctrine already requires it

Modern warfare has crossed a threshold where superiority is no longer defined by:

• platforms

• airframes

• hulls

It is defined by compute at the edge

AI warfighting is not about bigger models or centralized training clusters
It is about continuous iteration of deployed intelligence under contested conditions

That requirement collapses every fragile assumption of the old semiconductor order

AI Warfighting Doctrine Forces The Shift

Modern warfare has crossed a threshold & superiority is no longer defined by platforms

Its defined by compute at the edge

Every major weapons and ISR system now depends on:

• Edge inference

• Sensor fusion

• Autonomy

• High-bandwidth mission processing

• Secure, radiation-tolerant 3D compute

These workloads:

• Can't run on legacy nodes

• Can't tolerate offshore iteration

• Can't survive fragmented packaging paths

AI Doctrine Forces Inland Control

AI-driven warfare demands:

• rapid silicon refresh cycles

• custom ASICs tuned to mission envelopes

• secure tape-out under classification

• advanced 2.5D / 3D packaging

• domestic validation authority

This cannot be achieved with:

• offshore OSATs

• foreign substrates

• distributed audit chains

• maritime logistics dependencies

AI doctrine forces the entire loop inland

Ohio exists because this doctrine exists

From Platforms to Systems of Systems

AI warfare shifts advantage from platforms to systems of systems:

• autonomy swarms

• sensor networks

• ISR fusion layers

• command-and-control compute

These systems are:

• power-constrained

• thermally constrained

• latency-sensitive

• iteration-dependent

They do not scale on GPUs alone
They scale on custom silicon packaged for survivability

RAMP-C - Quiet Catalyst

The Department of Defense has already rewritten the rules through RAMP C
(Rapid Assured Microelectronics Prototypes – Commercial)

The DoD’s quiet Manhattan Project for microelectronics

• custom silicon at advanced nodes

• domestic tape-out

• U.S.-only advanced packaging

• shortened iteration cycles

• classified manufacturing environments

This is a structural mandate - Could even argue that this push into Ohio only exists because RAMP C exists

RAMP-C converts defense primes into hyperscaler-style silicon customers

Ohio’s campus was selected because it can scale from 2 → 8+ fabs, turning the U.S. into:

• A domestic ASIC powerhouse

• The world’s defense-oriented semiconductor hub

• The manufacturing engine behind Replicator, NGAD, CCA, ISR, and missile defense

Named Demand Gravity (PROGRAMS THAT REQUIRE OHIO-CLASS SILICON)

Once warfare is defined by edge compute, autonomy, and iteration speed, demand stops being theoretical and becomes program bound

A small set of U.S. defense initiatives now require advanced domestic logic, advanced packaging, and inland validation to function at all:

• NGAD – distributed sensor fusion, autonomy-assisted combat systems, rapid silicon refresh

• CCA – power-constrained autonomy ASICs with continuous iteration cycles

• Golden Dome – persistent sensor fusion, hardened compute, secure packaging

• Space-based ISR refresh – radiation-tolerant 3D compute with compressed upgrade timelines

These programs cannot execute on legacy nodes
They cannot tolerate offshore packaging

Once designed their silicon demand does not migrate, fluctuate, or wait for price discovery - - it locks

This is why Ohio does not need to be “chosen.”
It becomes mandatory when these programs cross their next compute threshold

Midwest Defense & Autonomy Layer

Anduril Industries - Arsenal-1

Arsenal-1 is the first true rate-production autonomous weapons factory in U.S. history:

• Multi-million-sq-ft autonomous systems campus

• CCA-class drones

• Counter-UAS systems

• Autonomous interceptors

• ISR platforms

Autonomous warfare now runs on software cadence and silicon iteration not platform refresh cycles

Arsenal-1 requires a domestic rapidly iterable compute supply chain

Proximity matters:

• ~20 miles from Intel Ohio One

• Same basin

• Same grid

• Same security envelope

Palantir - The AI Command & Control Plane

Palantir binds:

• Intel silicon

• Anduril / Boeing hardware

• Hyperscaler compute

• DoD operational networks

This creates a vertically integrated AI warfare stack:

Intel (compute) → Anduril/Boeing (hardware) → Palantir (command OS)

Palantir systems can't tolerate:

• Foreign packaging

• Non-auditable silicon

• Maritime logistics risk

Advanced Air Mobility → Defense Conversion Pipeline

Ohio hosts the only AAM ecosystem that naturally converts civil autonomy into military capability

Anchors:

• Joby Aviation (Dayton + second Ohio facility)

• GE Aerospace (Cincinnati)

• Wright-Patterson AFB

• Rickenbacker Airport

• Ohio BVLOS autonomy corridors

Civil platforms become military assets through stress testing.

Joby Aviation relevance:

• Large Dayton footprint + 2nd site as of 1/7/25

• Direct adjacency to Wright-Patt / AFRL

• Autonomy corridor access

• ~70 miles from Intel Ohio One

• "Joby Aviation says it has signed an agreement to acquire a more than 700,000 square foot manufacturing facility in the Dayton, Ohio area"

• Same inland defense industrial spine

Ohio operations stress test:

• Autonomous routing & landing

• Redundant compute avionics

• Battery performance across climate extremes

• Runway independent logistics

Wright-Patterson AFB - The Validation Core

Wright-Patt is the keystone of the Ohio Doctrine:

• AFRL autonomy & weapons research

  • Air Force Research Laboratory

• NASIC ISR analysis

  • National Air and Space Intelligence Center

• EW, avionics, autonomy testing

• Classified silicon qualification

As stated before, this is where:

• Chips are certified

• Autonomy stacks are hardened

• ISR payloads validated

• EW systems stress-tested

No coastal fab region controls its own validation clock... Ohio does

With Intel Ohio + Wright-Patt:

• Silicon is fabricated inland

• Packaged inland

• Validated inland

• Deployed without coastal dependency

Rickenbacker

The Operational Nexus

Rickenbacker is one of the few dedicated cargo focused international airports in the world

This makes it the ideal environment for the FAA to test how to detect and mitigate drone threats without disrupting massive commercial logistics chains

• Logistics Testing: Validating how ISR (Intelligence, Surveillance, and Reconnaissance) payloads function in high-traffic cargo environments

• EW Implementation: Testing Electronic Warfare (EW) and counter-UAS systems in a civilian-regulated airspace

Strategic Connectivity

Rickenbacker is located less than an hour's drive from Wright-Patterson AFB.. This creates a high speed feedback loop:

• Test at Rickenbacker: Identify failures in the detection stack or silicon performance

• Validate at Wright-Patt: Immediately return data to the Air Force Research Laboratory for hardening

• Fabricate at Intel: Iterate the hardware at the nearby New Albany "Silicon Heartland" fabs

Interestingly, they were selected by FAA in 2021

Defense Primes as Demand Engines

The U.S. defense primes are no longer just metal benders, integrators, or platform builders - - They are becoming the single largest demand engines for domestic, leading-edge silicon

• AI warfare = compute warfare

• Compute warfare = semiconductor sovereignty

• Semiconductor sovereignty = Intel Ohio

Every major U.S. prime now depends on:

• Custom silicon

• Advanced packaging

• Secure domestic tape out

• Rapid iteration under classification

Which collapses demand toward Ohio

Prime exposure by compute domain:

• Boeing - autonomy, ISR, space systems

• Lockheed Martin - mission systems, radar compute

• Northrop Grumman - ISR, nuclear command, space payloads

• RTX - missile seekers, EW, radar processors

Each upgrade cycle requires new silicon
Each silicon generation requires advanced packaging
Each secure packaging path leads inland

https://www.google.com/maps/d/u/0/edit?mid=1Muq4_eZtYHURmg78QgLH_V1pg1DWz7M&ll=40.6833042090353%2C-83.48253274316792&z=8

Why Cloud Demand Could be Pulled Inland

AI workloads are exploding beyond general purpose GPUs

Hyperscalers face the same constraints as defense:

• Advanced TSMC nodes fully booked

• AI demand is not elastic

• Dual-sourcing no longer optional

Cloud providers now require:

• Custom accelerators

• Chiplet based architectures

• Secure geographic redundancy

• Domestic capacity insulated from tariffs and disruption

TSMC capacity at advanced nodes is oversubscribed & Apple / Nvidia / AMD / Broadcom / Qualcomm already saturate the pipeline..

The anchor customers are pretty obvious:

• Microsoft, Amazon, Google as hyperscale compute buyers

  • My favorite bet is Amazon being anchor

  • 

• DoD as secure provisioning and defense cloud demand driver

  • I think they might beat Amazon to the punch and really force Intel One to be defense based from day 1

Ohio absorbs forced overflow demand created by:

• Node saturation

• Geopolitical risk

• Policy alignment

Ohio offers what coastal sites can not:

• Inland security

• Stable power and water

• Advanced packaging at scale

• Proximity to defense customers

• Tariff-insulated domestic wafers

Intel Ohio is embedded inside one of the heaviest hyperscale concentrations in America:

AWS - multi tens of billions regional expansion
Google - New Albany data corridor
Microsoft Azure - federal & defense workloads

Wafer → Package → Secure Provisioning → Cloud Training → Deployment
All inside 100 miles...

Defense Validates - - Cloud Amplifies

Defense demand creates necessity:

• Forces compliance

• Anchors continuity

• Hardens security

Cloud demand creates scale:

• Brings volume

• Subsidizes yield ramps

• Lowers unit cost

• Hardens infrastructure

Together they form a reinforcing loop:

• Commercial scale hardens defense

• Defense requirements harden commercial scale

  • Hyperscalers bring volume

At this point demand is no longer theoretical

The only remaining variables are:

• Who commits first

• How ignition occurs

• How fast the system expands once it does

Acceleration

If anchor demand commits, timelines compress because the system is already built for it

Utilities are oversized - Subfabs are sealed - Civil geometry is High-NA-ready

Acceleration is not speculation its conditional physics

From January 17th 2025 - December 2025 - - Watch the difference in these videos

New Betchel Job listings for Intel Ohio - - time to ramp up constuction??

https://www.tomshardware.com/tech-industry/semiconductors/intels-ohio-one-project-shows-healthy-progress-as-new-job-listings-pop-up-construction-seems-to-be-well-underway-as-contractor-actively-hiring-for-ambitious-chip-factory?utm_source=chatgpt.com

Finance, Insurance, AND Continuity

Fabs do not stop only because of bombs & physical war

They stop when:

• war-risk insurance voids

• reinsurance withdraws

• capital freezes

• financing collapses

Ohio avoids this regime entirely:

• inland insurability

• no maritime exposure

• defense-aligned underwriting

• domestic reinsurance continuity

Capital continuity is operational continuity

Systems Do Not Scale on Steel Alone

Megaprojects fail when capital talent and policy drift out of alignment & Ohio is doing the opposite

As physical infrastructure locks, soft infrastructure follows:

• Federal alignment

• Financial talent

• Defense integration

Ohio’s ecosystem is reinforced by:

• National labs

• Defense test ranges

• Hyperscale campuses

• Industrial research institutions

which is why it scales under stress rather than hype

Finance Must Match the Risk Profile

Intel Ohio is generating a new class of companies that traditional banks do not serve

These firms share the same traits

• Long pre revenue cycles

• Milestone based defense contracts

• High capital intensity

• Export controlled IP

• Non standard collateral

• Classified customer bases

This category collapsed when Silicon Valley Bank failed & that failure created a vacuum
Ohio is filling it

Erebor Bank

The Missing Financial Layer

Erebor is a Peter Thiel backed post SVB financial institution purpose built for

• Defense and dual use technology

• Advanced manufacturing

• Classified and export controlled companies

• Hard tech suppliers with lumpy cash flows

• Semiconductor and autonomy ecosystems

This is not a retail bank

It is industrial underwriting

Why Erebor Matters to Intel Ohio

Intel Ohio is spawning

• Advanced packaging startups

• Photonics suppliers

• Materials firms

• Defense ASIC design houses

• Autonomy compute vendors

• Classified subcontractors

These firms can't operate inside JPM or BofA risk models

Erebor exists for exactly this ecosystem & Columbus, Ohio is their Headquarters...

Banks do not arrive after ecosystems mature - they arrive when capital velocity is about to spike

Why Columbus Is Not a Coincidence

Central Ohio sits inside a unique convergence

• Intel Ohio One & Two

• Wright-Patterson Air Force Base

• Anduril Arsenal-1

• Midwest substrate corridor

• Hyperscale cloud belt

• Defense-cleared industrial workforce

• Inland geography

Erebor anchoring here signals expected deal flow

Strategic Alignment - - Not Accidental Overlap

Peter Thiel’s worldview aligns directly with the Ohio construct:

• sovereign manufacturing over globalization

• national security over cost optimized fragility

• hard tech over attention economies

• friend shored capital stacks

• resilience as a strategic asset

Together Erebor & Intel suggest the U.S. is rebuilding not just factories but an entire sovereign industrial finance model that has not existed FOR DECADES

With Erebor in the ecosystem:

• Defense suppliers scale without JPM or BofA approval

• Classified startups bank without existential friction

• Intel-aligned design houses finance tape-outs domestically

• Autonomy and ISR companies survive long DoD cycles

This transforms Intel Ohio from a megaproject into a self sustaining industrial system

The presence of a Thiel backed defense oriented bank near Ohio is not a footnote it is a signal that the financial system is reorganizing itself around Intel Ohio... the same way power grids, logistics, substrates, and defense programs already are

In wartime or financial stress scenarios this layer determines whether the industrial base stalls or continues operating under pressure

Workforce as a Strategic Asset

Ohio solves the talent problem under stress

• Defense cleared labor pools

• Veteran engineering pipelines

• Lower cost of living = faster scaling

• Surge hiring possible without coastal bottlenecks

Talent scales faster inland during crisis

Workforce becomes a weapon

Talent Migration Follows Design Gravity

Physical capacity attracts execution talent while design inevitability attracts leadership

Under Lip Bu Tan Intel has begun shifting leadership weight away from local execution and toward system level alignment and recent hires reflect this pivot

Policy and Federal Alignment

Robin Colwell
Senior Vice President Government Affairs

Former White House National Economic Council official

Robin Colwell’s role is not local permitting -its federal alignment

At the National Economic Council she worked directly on Trump era economic security policy including:

• Domestic manufacturing reshoring

• Trade and tariff strategy

• Supply chain resilience

• National competitiveness

• Reported directly to NEC Director Larry Kudlow

That background is directly relevant to Intel Ohio

Intel did not elevate a former NEC official to manage a regional project..

Colwell’s presence reframes Ohio as a national interest asset

Her role is to align Intel Ohio with

• CHIPS Act capital flows

• Trump era and successor tariff regimes

• Defense procurement priorities

• Export control enforcement

• Federal energy and grid policy

This is how projects move from state sponsored builds to federally protected infrastructure

Intel does not place NEC level leadership on optional site hopes

This hire signals that Intel Ohio is being treated as permanent national infrastructure, not a cycle dependent expansion

Defense and Design Alignment

James Chew
Aerospace Defense and Government Enablement

James Chew’s role sits upstream of manufacturing
He operates at the design decision layer where defense and aerospace systems are architected before tape out

Prior to Intel he spent ~10 years at Cadence leading aerospace defense and government strategy including 6 years under Lip Bu Tan - 2015 - 2021

At Cadence he worked directly with

• Boeing

• Lockheed Martin

• Northrop Grumman

• RTX

• Anduril

• Classified defense programs

Defense programs do not choose fabs at the manufacturing stage
They choose them at the architecture stage

Chew’s role is to pull Intel Ohio into defense system designs before silicon commitments are made

By placing Chew in this role Intel is ensuring that:

• Defense ASICs

• Autonomy processors

• ISR silicon

• Secure networking chips

are architected from day one to run on Intel process nodes and packaging flows

That is how fabs get designed into programs

Intel does not deploy design enablement leadership like this to speculative capacity - this indicates Ohio is expected to be a long term anchor for defense grade silicon... not an experimental foundry site . . another indication Ohio is THE spot

https://www.linkedin.com/posts/james-chew-091949_contracts-for-december-18-2025-activity-7419031166978158592-UIax/?utm_source=share&utm_medium=member_ios&rcm=ACoAAERJiZwB_TZzQeVkood2Bu0UfjhFfl7VBCo

He was just lead on this Project Shield Contract:

https://techovedas.com/intel-wins-151b-shield-defense-contract-strengthening-u-s-semiconductor-security/

Process and Execution Alignment

Pushkar Ranade
Technical Bridge and Foundry Enablement

Pushkar Ranade operates at the interface between design process and manufacturing
His role is to translate customer architecture requirements into manufacturable reality at Intel Foundry

• Functions as a bridge CTO in addition to current role as LBT Chief of Staff

This function becomes critical at 14A class nodes where:

• Design assumptions directly affect yield

• Packaging choices determine feasibility

• Process constraints must be resolved before tape out

His role exists to prevent the single biggest foundry failure mode:
building capacity ahead of real customer designs

He tightens the feedback loop between:

• Customer architectures

• EDA enablement

• Intel process and packaging realities

This reduces execution risk before capital is committed

Intel does not elevate this role unless external demand is expected

The Emerging Pattern

What is happening in Ohio mirrors Lip Bu Tan’s Cadence playbook almost exactly

• Design inevitability first

• Physical capacity second

• Scale only after certainty

This is how Cadence locked itself into every major semiconductor program globally
Intel is now applying the same logic to manufacturing

• Talent is being positioned before volume commitments

• Design enablement is being solved before fabs are turned on

• Capacity is waiting for architecture

That sequencing only makes sense if real external demand is expected

Speculation Hires:

Nimish Modi - keep this name noted he will be a huge player in INTC ecosystem one way or another

• Longtime Cadence SVP who worked closely under Lip-Bu Tan during his CEO tenure (2009–2021)

  • Worked under LBT from 2013-2021

    • Primarily in strategy and execution focused roles

• Widely viewed as one of Tan’s most seasoned and trusted enterprise operators

• At INTC he would likely be tasked with enforcing cross company execution discipline across Foundry, Products, and Defense

• Strong candidate for next CTO

Boyd Phelps -

• SVP & GM of Cadence’s Silicon Solutions Group

  • Operating at the system design and advanced packaging layer

• Worked under LBT from 2016-2021

• Deep credibility in chiplets, heterogeneous integration, and design enablement

• He spoke at Intel Foundry Direct Connect in April this year

• Most likely to fill a senior systems, packaging, or architecture focused leadership role, not the CTO replacement

Ohio Forever

Like I said at the beginning, Intel Ohio is not a factory - It’s the strategic heart of the next American arsenal where the silicon for NGAD, CCA, hypersonics, Golden Dome, missile defense, autonomy, and space ISR will be designed, packaged, qualified, and deployed

An inland fortress of power designed to endure / engineered to scale / built to survive

It won't be exclusively for defense but it seems more and more likely it'll be heavy focused on defense side of the business

Within a 50-mile radius now exist:

• The fab

• The grid

• The cloud

• Autonomy factories

• Propulsion and actuation

• Military validation

• Capital continuity

There is no equivalent... not in Taiwan, not in Korea, not in Japan, and not in Europe

Arizona fabricates
Taiwan manufactures
Ohio controls what becomes operational when it matters

Welcome to Ohio... Ohio Forever

https://baxtel.com/data-center/ohio?lat=40.38575005000084&lng=-82.68845952032099&distance=187285.49533291048

https://www.google.com/maps/d/u/0/edit?mid=1Muq4_eZtYHURmg78QgLH_V1pg1DWz7M&ll=39.795075894873335%2C-83.5646912927148&z=9